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Volumn 9, Issue 3, 2002, Pages 179-197

Thermal residual stresses in bonded repairs

Author keywords

Bonded repair; Coefficient of thermal expansion (CTE); Glare; Thermal residual stress

Indexed keywords

AGING OF MATERIALS; AIRCRAFT; COMPUTER PROGRAM LISTINGS; COST EFFECTIVENESS; FINITE ELEMENT METHOD; RESIDUAL STRESSES; STRAIN; THERMAL STRESS;

EID: 0036568711     PISSN: 0929189X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1014790304207     Document Type: Article
Times cited : (14)

References (10)
  • 2
    • 0008767679 scopus 로고    scopus 로고
    • Flight International, 2000 June


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.