Study of dynamic grain growth by electron microscopy and EBSD

Journal of Microscopy

Volumn 233, Issue 3, 2009, Pages 432-441

  Rofman, O V ^a   Bate, P S ^a   Brough, I ^a   Humphreys, F J ^a  

^a UNIVERSITY OF MANCHESTER   (United Kingdom)

Author keywords

Dynamic grain growth; EBSD; In situ; Particle coarsening

Indexed keywords

ALUMINUM ALLOYS; BINARY ALLOYS; COPPER ALLOYS; ELECTRON MICROSCOPES; GRAIN BOUNDARIES; GRAIN GROWTH;

AL-4WT%CU; ALUMINUM-COPPER ALLOY; DEFORMED MICROSTRUCTURE; DYNAMIC GRAIN GROWTH; EBSD; IN SITU; PARTICLE COARSENING; STRAIN-INDUCED GRAIN GROWTH; SUPERPLASTIC PROPERTIES; SURFACE MARKERS;

ELECTRON MICROSCOPY;

ALLOY; ALUMINUM; COPPER;

ARTICLE; CONTROLLED STUDY; CRYSTALLIZATION; DYNAMICS; ELECTRON BACKSCATTER DIFFRACTION; ELECTRON DIFFRACTION; ELECTRON MICROSCOPY; GRAIN; GROWTH; IMAGE ANALYSIS; INTERMETHOD COMPARISON; PRIORITY JOURNAL; SCANNING ELECTRON MICROSCOPY; STRUCTURE ANALYSIS; SURFACE PROPERTY;

EID: 61449121073     PISSN: 00222720     EISSN: 13652818     Source Type: Journal    
DOI: 10.1111/j.1365-2818.2009.03131.x     Document Type: Article

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