The application of a hot deformation SEM stage, backscattered electron imaging and EBSD to the study of thermomechanical processing

Journal of Microscopy

Volumn 208, Issue 1, 2002, Pages 18-23

  Huang, Yan ^a   Humphreys, F J ^a   Brough, I ^a  

^a UNIVERSITY OF MANCHESTER   (United Kingdom)

Author keywords

Aluminium; EBSD; In situ hot deformation; SEM

Indexed keywords

BACKSCATTERING; DYNAMIC RECRYSTALLIZATION; DYNAMICS; ELECTRONS; GRAIN GROWTH; STRAIN; SURFACE TOPOGRAPHY;

BACKSCATTERED ELECTRON IMAGING; DIFFRACTION SYSTEMS; ELECTRON BACK-SCATTERED DIFFRACTION; FIELD EMISSION GUN SCANNING ELECTRON MICROSCOPE; HIGH RESOLUTION; HOT TENSILE; IN SITU HOT DEFORMATION; SIMPLE++; TENSILE STRAINING; THERMOMECHANICAL PROCESSING;

SCANNING ELECTRON MICROSCOPY;

ALUMINUM; COPPER; METAL;

ARTICLE; CHEMICAL PROCEDURES; CHEMICAL STRUCTURE; CRYSTALLIZATION; ELECTRON BACKSCATTERED DIFFRACTION; ELECTRON MICROSCOPY; FIELD EMISSION; FIELD EMISSION GUN SCANNING ELECTRON MICROSCOPE; GRAIN; PRIORITY JOURNAL; SCANNING ELECTRON MICROSCOPY; TEMPERATURE; THERMODYNAMICS; TOPOGRAPHY;

EID: 0036439007     PISSN: 00222720     EISSN: None     Source Type: Journal    
DOI: 10.1046/j.1365-2818.2002.01061.x     Document Type: Article

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