|
Volumn 48, Issue 2, 2009, Pages
|
Characterization and analyses of interface structures in directly bonded Si(011)/Si(001) substrates
a,b c a a a d b b
a
Nissei Bldg
(Japan)
|
Author keywords
[No Author keywords available]
|
Indexed keywords
SEMICONDUCTING SILICON COMPOUNDS;
SILICON WAFERS;
SUBSTRATES;
TRANSMISSION ELECTRON MICROSCOPY;
CROSS-SECTIONAL TEM;
CRYSTALLINITY;
DEFORMATION FIELDS;
GRAZING INCIDENCES;
IN PLANES;
INTERFACE STRUCTURES;
INTERFACIAL PLANES;
INTERFACIAL STRUCTURES;
MOSAIC STRUCTURES;
SCREW DISLOCATIONS;
SI (001) SUBSTRATES;
SI(0 0 1);
SI(011);
TEM;
THREADING DISLOCATIONS;
X- RAY DIFFRACTIONS;
XRD ANALYSIS;
SILICON;
|
EID: 60849084138
PISSN: 00214922
EISSN: 13474065
Source Type: Journal
DOI: 10.1143/JJAP.48.021208 Document Type: Article |
Times cited : (8)
|
References (7)
|