Improved water resistance of soy protein adhesive at isoelectric point

Transactions of the ASABE

Volumn 52, Issue 1, 2009, Pages 173-177

  Wang, Donghai ^a   Sun, X S ^b   Yang, G ^a   Wang, Y ^c  

^a Sunflower Networking Group   (United States)

^b KANSAS STATE UNIVERSITY   (United States)

^c PENNSYLVANIA STATE UNIVERSITY   (United States)

Author keywords

Adhesive strength; Denaturation; Isoelectric pH; Protein modification; Soy protein isolates; Water resistance

Indexed keywords

ADHESIVE STRENGTH; ISOELECTRIC PH; PROTEIN MODIFICATION; SOY PROTEIN ISOLATES; WATER RESISTANCE;

BOND STRENGTH (MATERIALS); CHARGED PARTICLES; DENATURATION; DIFFERENTIAL SCANNING CALORIMETRY; PH EFFECTS; POLYSACCHARIDES; PYROLYSIS; RHEOLOGY; SURFACE CHARGE; SUSPENSIONS (FLUIDS);

INTERCHANGES;

ADHESION; CALORIMETRY; MECHANICAL PROPERTY; PH; POLYSACCHARIDE; PROTEIN; RHEOLOGY;

GLYCINE MAX;

EID: 60749110975     PISSN: 21510032     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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