Crack-healing behavior of Si 3N 4/SiC composite under low oxygen partial pressure

Zairyo/Journal of the Society of Materials Science, Japan

Volumn 57, Issue 11, 2008, Pages 1132-1137

  Jung, Young Soon ^a   Nakao, Wataru ^a   Takahashi, Koji ^a   Ando, Kotoji ^a   Satto, Shmji ^b  

^a YOKOHAMA NATIONAL UNIVERSITY   (Japan)

^b Dept NHK SPRING Co   (Japan)

Author keywords

Bending strength; Crack healing; High temperature strength; Low oxygen partial pressure; Si 3N 4 SiC composite

Indexed keywords

CRACK-HEALING; CRACK-HEALING BEHAVIORS; HIGH TEMPERATURES; HIGH-TEMPERATURE STRENGTH; INDENTATION METHODS; LOW OXYGEN PARTIAL PRESSURE; OXYGEN PARTIAL PRESSURES; ROOM TEMPERATURES; SEMI-ELLIPTICAL SURFACE CRACKS; SI 3N 4/SIC COMPOSITE; SINTERING ADDITIVES; TENSILE SURFACES; TUBE FURNACES;

ADDITIVES; CRACKS; OXYGEN; PARTIAL PRESSURE; POSITIVE IONS; SILICON; SILICON CARBIDE; SINTERING; STRENGTH OF MATERIALS; SURFACE TREATMENT;

BENDING STRENGTH;

EID: 59649110082     PISSN: 05145163     EISSN: None     Source Type: Journal    
DOI: 10.2472/jsms.57.1132     Document Type: Article

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