Voltammetric and morphological characterization of copper electrodeposition from non-cyanide electrolyte

Journal of Applied Electrochemistry

Volumn 32, Issue 7, 2002, Pages 763-773

  De Almeida, M R H ^a   Carlos, I A ^a   Barbosa, L L ^a   Carlos, R M ^b   Lima Neto, B S ^b   Pallone, E M J A ^a  

^a FEDERAL UNIVERSITY OF SÃO CARLOS   (Brazil)

^b UNIVERSITY OF SÃO PAULO   (Brazil)

Author keywords

AISI 1010 steel electroplating; Copper; Glycerol; Non cyanide bath; Sulfate

Indexed keywords

COMPOSITION EFFECTS; COPPER; ELECTROLYTES; GLYCEROL; METALLIC FILMS; MORPHOLOGY; NEGATIVE IONS; REDUCTION; SCANNING ELECTRON MICROSCOPY; SODIUM COMPOUNDS; STEEL; VOLTAGE MEASUREMENT;

COPPER ELECTRODEPOSITION; COPPER FILMS; GLYCERINATE ANIONS; NON-CYANIDE ELECTROLYTE; VOLTAMMETRIC CHARACTERIZATION;

ELECTRODEPOSITION;

EID: 0036660184     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1020182120035     Document Type: Article

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