Finite element study of fatigue life prediction methods for thermally loaded solder joints

American Society of Mechanical Engineers, EEP

Volumn 4-2, Issue , 1993, Pages 1063-1070

  Paydar, N ^a   Tong, Y ^a   Akay, H U ^a  

^a INDIANA UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CREEP; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FORECASTING; MATHEMATICAL MODELS; PLASTICITY; PRINTED CIRCUIT MANUFACTURE; STRAIN; THERMAL LOAD; THREE DIMENSIONAL;

ENERGY PARTITIONING; PLASTIC DEFORMATION; SOFTWARE PACKAGE = ABAQUS; SOLDER RESISTOR BOARD ASSEMBLY; STRAIN LIFE;

SOLDERED JOINTS;

EID: 0027841773     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)