Efficiency measures of PCB manufacturing firms using relational two-stage data envelopment analysis

Expert Systems with Applications

Volumn 36, Issue 3 PART 1, 2009, Pages 4935-4939

  Liu, Shiang Tai ^a   Wang, Rong Tsu ^a  

^a VANUNG UNIVERSITY   (Taiwan)

Author keywords

Data envelopment analysis; Decomposition; Efficiency; Printed circuit board

Indexed keywords

DATA ENVELOPMENT ANALYSIS; DECOMPOSITION; EFFICIENCY; PRINTED CIRCUIT MANUFACTURE; PRODUCTIVITY; PROFITABILITY;

EFFICIENCY MEASURE; MANUFACTURING FIRMS; PRINTED CIRCUIT BOARDS (PCB); PRODUCT IMPROVEMENT; PRODUCTION ACQUISITIONS; PRODUCTION PROCESS; PRODUCTION TECHNOLOGY; TECHNOLOGICAL INNOVATION;

PRINTED CIRCUIT BOARDS;

EID: 58349110318     PISSN: 09574174     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.eswa.2008.06.014     Document Type: Article

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