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Volumn , Issue , 2001, Pages 336-340

Modeling electromagnetic emission of integrated circuits for system analysis

Author keywords

[No Author keywords available]

Indexed keywords

DEVELOPED MODEL; ELECTROMAGNETIC EMISSIONS; MODEL PARAMETERS; MULTIPOLE EXPANSIONS; PHYSICAL MODEL; SYSTEM LEVELS;

EID: 58149272321     PISSN: 15301591     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DATE.2001.915046     Document Type: Conference Paper
Times cited : (10)

References (11)
  • 1
    • 0031246726 scopus 로고    scopus 로고
    • Icrowave-circuit modeling of high lead-count plastic packages
    • October
    • R. W. Jackson. M icrowave-Circuit Modeling of High Lead-Count Plastic Packages. In IEEE Transactions on Microwave Theory and Techniques, Vol. 45, No. 10, October 1997.
    • (1997) IEEE Transactions on Microwave Theory and Techniques , vol.45 , Issue.10
    • Jackson, R.W.M.1
  • 5
    • 0031363747 scopus 로고    scopus 로고
    • Characteristics of RF Emissions from a family of Microprozessors using a 1GHz TEM Cell
    • Austin
    • J. P. Muccioli, T. M. North, K. P. Slattery. Characteristics of RF Emissions from a family of Microprozessors using a 1GHz TEM Cell. In IEEE International Symposium on EMC, Austin, 1997.
    • (1997) IEEE International Symposium on EMC
    • Muccioli, J.P.1    North, T.M.2    Slattery, K.P.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.