Surface stress effect on bending resonance of nanowires with different boundary conditions

Applied Physics Letters

Volumn 93, Issue 26, 2008, Pages

  He, Jin ^a   Lilley, Carmen M ^a  

^a 1120 Science and Engineering Offices   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); BOUNDARY CONDITIONS; BOUNDARY VALUE PROBLEMS; ELASTIC MODULI; ELASTICITY; LAPLACE EQUATION; NANOWIRES; RESONANCE; STRESSES; SURFACE PROPERTIES;

BENDING RESONANCES; BERNOULLI BEAM THEORIES; MECHANICAL BEHAVIORS; NONDIMENSIONAL; RESONANCE FREQUENCIES; STATIC BENDING; SURFACE EFFECTS; SURFACE STRESS EFFECTS; SURFACE STRESSES; YOUNG'S MODULUS;

ELECTRIC WIRE;

EID: 58149230969     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3050108     Document Type: Article

References (21)

1. A. Husain, J. Hone, H. W. C. Postma, X. M. H. Huang, T. Drake, M. Barbic, A. Scherer, and M. L. Roukes, Appl. Phys. Lett. 83, 1240 (2003).
2. M. Li, T. S. Mayer, J. A. Sioss, C. D. Keating, and R. B. Bhiladvala, Nano Lett. 7, 3281 (2007).
3. C. Q. Chen, Y. Shi, Y. S. Zhang, J. Zhu, and Y. J. Yan, Phys. Rev. Lett. 96, 075505 (2006).
4. X. X. Li, T. Ono, Y. L. Wang, and M. Esashi, Appl. Phys. Lett. 83, 3081 (2003).
5. G. Y. Jing, H. L. Duan, X. M. Sun, Z. S. Zhang, J. Xu, Y. D. Li, J. X. Wang, and D. P. Yu, Phys. Rev. B 73, 235409 (2006).
6. M. J. Lachut and J. E. Sader, Phys. Rev. Lett. 99, 206102 (2007).
7. S. Cuenot, C. Fretigny, S. Demoustier-Champagne, and B. Nysten, Phys. Rev. B 69, 165410 (2004).
8. M. E. Gurtin and A. I. Murdoch, Arch. Ration. Mech. Anal. 57, 291 (1975).
9. P. Lu, H. P. Lee, C. Lu, and S. J. O'Shea, Phys. Rev. B 72, 085405 (2005).
10. J. Lagowski, H. C. Gatos, and E. S. Sproles, Appl. Phys. Lett. 26, 493 (1975).
11. M. E. Gurtin, X. Markenscoff, and R. N. Thurston, Appl. Phys. Lett. 29, 529 (1976).
12. A. W. McFarland, M. A. Poggi, M. J. Doyle, L. A. Bottomley, and J. S. Colton, Appl. Phys. Lett. 87, 053505 (2005).
13. Y. X. Chen, B. L. Dorgan, D. N. McIlroy, and D. E. Aston, J. Appl. Phys. 100, 104301 (2006).
14. W. J. Mai and Z. L. Wang, Appl. Phys. Lett. 89, 073112 (2006).
15. J. He and C. M. Lilley, Nano Lett. 8, 1798 (2008).
16. T. Y. Chen, M. S. Chiu, and C. N. Weng, J. Appl. Phys. 100, 074308 (2006).
17. See EPAPS Document No. E-APPLAB-93-106850 for additional information on Equation 1 and Figure 4. For more information on EPAPS, see http://www.aip.org/ pubservs/epaps.html.
18. G. F. Wang and X. Q. Feng, Appl. Phys. Lett. 90, 231904 (2007).
19. H. S. Park and P. A. Klein, J. Mech. Phys. Solids 56, 3144 (2008).
20. H. S. Park, P. A. Klein, and G. J. Wagner, Int. J. Numer. Methods Eng. 68, 1072 (2006).
21. V. B. Shenoy, Phys. Rev. B 71, 094104 (2005).