Buried components in printed circuit boards

Advancing Microelectronics

Volumn 32, Issue 3, 2005, Pages 13-18

  Ostmann, A ^a   Neumann, A ^b   Sommer, P ^a   Reichl, H ^b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

3D packaging; Chip in Polymer; Embedded chips

Indexed keywords

COMPUTER SIMULATION; EMBEDDED SYSTEMS; FINITE ELEMENT METHOD; METALLIZING; MICROPROCESSOR CHIPS; NATURAL FREQUENCIES; POLYMERS; SIGNAL PROCESSING;

CHIP IN POLYMER (CIP); CHIP SIZE PACKAGE (CSP); EMBEDED CHIPS; THREE-DIMENSIONAL (3D) PACKAGING;

PRINTED CIRCUIT BOARDS;

EID: 21644472233     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

References (12)

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