Octanethiolated Cu and Cu 2 O nanoparticles as ink to form metallic copper film

Applied Surface Science

Volumn 255, Issue 6, 2009, Pages 3891-3896

  Dong, T Y ^a   Wu, H H ^a   Huang, C ^a   Song, J M ^b   Chen, I G ^c   Kao, T H ^c  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b NATIONAL DONG HWA UNIVERSITY   (Taiwan)

^c NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Conductivity; Film; Monolayer protected cluster; Nanoparticle

Indexed keywords

COPPER; COPPER OXIDES; ELECTRIC CONDUCTIVITY; FILMS; METAL NANOPARTICLES; METALLIC FILMS; MONOLAYERS; NANOMAGNETICS; NANOPARTICLES; NUCLEAR MAGNETIC RESONANCE; NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY; PROTECTIVE ATMOSPHERES; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SYNTHESIS (CHEMICAL);

2D SUPERLATTICE; COPPER METAL FILMS; COPPER NANOPARTICLES; HEXAGONAL PACKING; MONOLAYER PROTECTED CLUSTERS; NUCLEAR MAGNETIC RESONANCE (NMR); SPECTROSCOPIC CHARACTERIZATION; THERMAL-ANNEALING;

X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 57849155348     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2008.10.085     Document Type: Article

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