Time effect on resistivity and rigidity of electrodeposited copper

Cailiao Kexue yu Gongyi/Material Science and Technology

Volumn 16, Issue 5, 2008, Pages 593-595

  Jiang, Li Qiang ^a   Sun, Wei ^a   Zheng, Jing Wu ^a  

^a ZHEJIANG UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Electrodeposited copper; Resistivity; Rigidity; Time effect

Indexed keywords

COPPER; COPPER METALLOGRAPHY; CORROSION; CURRENT DENSITY; GRAIN SIZE AND SHAPE; MAGNETRONS; METALLIC FILMS; RIGIDITY;

CATHODE CURRENT DENSITIES; COPPER FILMS; CRYSTAL GRAIN SIZES; ELECTRODEPOSITED COPPER; ELECTRODEPOSITED COPPERS; FAULT DENSITIES; MICRO HARDNESSES; RESISTIVITY; STEEL SUBSTRATES; STORAGE TIMES; TIME EFFECT; TIME EFFECTS;

ELECTRODEPOSITION;

EID: 57449119278     PISSN: 10050299     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

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