A new class of low bake resists for 193-nm immersion lithography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6923, Issue , 2008, Pages

  Sooriyakumaran, Ratnam ^a   DiPietro, Richard ^a   Truong, Hoa ^a   Brock, Phillip ^a   Allen, Robert ^a   Bozano, Luisa ^a   Popova, Irene ^b   Huang, Wu Song ^b   Chen, Rex ^b   Khojasteh, Mahmoud ^b   Varanasi, Pushkara Rao ^b  

^a IBM ALMADEN RESEARCH CENTER   (United States)

^b IBM   (United States)

Author keywords

Acetal; Chemically amplified resists; Image blur; Immersion lithography; Low activation energy; Low bake; Tertiary ester

Indexed keywords

ACETAL; CHEMICALLY AMPLIFIED RESISTS; IMAGE BLUR; IMMERSION LITHOGRAPHY; LOW ACTIVATION ENERGY; LOW BAKE; TERTIARY ESTER;

ACTIVATION ENERGY; DATA STORAGE EQUIPMENT; ESTERIFICATION; ESTERS; ORGANIC COMPOUNDS; PHOTOLITHOGRAPHY; PHOTORESISTORS; SEMICONDUCTOR DOPING;

PHOTORESISTS;

EID: 57349186021     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.772947     Document Type: Conference Paper

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