New solutions for reusing nonmetals reclaimed from waste printed circuit boards

IEEE International Symposium on Electronics and the Environment

Volumn , Issue , 2005, Pages 205-209

  Mou, Peng ^a   Xiang, Dong ^a   Pan, Xiaoyong ^a   Wa, Layiding ^a   Gao, Jiangang ^a   Duan, Guanghong ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Compound boards; Mechanical fearture; Recycling; Reusing

Indexed keywords

BENDING STRENGTH; ENVIRONMENTAL PROTECTION; NONMETALS; PROBLEM SOLVING; RECYCLING; SOLID WASTES; TENSILE PROPERTIES;

COMPOUND BOARDS; FORMATIVE MODELS; MECHANICAL FEATURES; REUSING;

PRINTED CIRCUIT BOARDS;

EID: 28744458105     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. S.YOKOYAMA, M.IJI, "Recycling of thermosetting Plastics Waste from Electronic Component Production Processed", Proceeding of 1995 IEEE International Symposium on Electronics and the Environment, pp. 132-137.
2. S.YOKOYAMA, M.IJI, "Recycling of Printed Wiring Boards with Mounted Electronic Parts", Proceeding of 1997 IEEE International Symposium on Electronics and the Environment, pp. 109-114.
3. Mashtoshi.IJI, "Recycling of epoxy resin compounds for moulding electronic components", Journal of Materials Science, Vol 33, pp45-53, 1998.
4. Yl Changping, LIU Jun, ZENG Jingcheng, ZENG Jianxiang, "Present Status and Developing Trend of Compound Well Lids", FRP and Compound Material, pp43-45, 2004.4.