Effects of thermocycling and use of ElectroBond on microtensile strength and nanoleakage using commercial one-step self-etch adhesives

European Journal of Oral Sciences

Volumn 116, Issue 6, 2008, Pages 564-570

  Visintini, Erika ^a   Mazzoni, Annalisa ^b   Vita, Francesca ^a   Pasquantonio, Guido ^c   Cadenaro, Milena ^a   Di Lenarda, Roberto ^a   Breschi, Lorenzo ^a,d  

^a UNIVERSITY OF TRIESTE   (Italy)

^b UNIVERSITY OF BOLOGNA   (Italy)

^c UNIVERSITY OF ROME TOR VERGATA   (Italy)

^d CNR   (Italy)

Author keywords

Adhesion; Dentin; Electricity; Microtensile; Thermocycling

Indexed keywords

DENTIN BONDING AGENT; RESIN CEMENT; XENO III;

ARTICLE; COMPARATIVE STUDY; DENTAL ACID ETCHING; DENTAL BONDING; DENTAL CARE; ELECTRIC CONDUCTIVITY; HUMAN; IONTOPHORESIS; METHODOLOGY; MOLAR TOOTH; NONPARAMETRIC TEST; RANDOMIZATION; TEMPERATURE; TENSILE STRENGTH; TOOTH DISEASE;

ACID ETCHING, DENTAL; DENTAL BONDING; DENTAL LEAKAGE; DENTAL STRESS ANALYSIS; DENTIN-BONDING AGENTS; ELECTRIC CONDUCTIVITY; HUMANS; IONTOPHORESIS; MOLAR, THIRD; RANDOM ALLOCATION; RESIN CEMENTS; STATISTICS, NONPARAMETRIC; TEMPERATURE; TENSILE STRENGTH;

EID: 56749171143     PISSN: 09098836     EISSN: 16000722     Source Type: Journal    
DOI: 10.1111/j.1600-0722.2008.00576.x     Document Type: Article

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