Effects of additives on copper electrodeposit roughness in chloride media

Hydrometallurgy 2008: Proceedings of the 6th International Symposium

Volumn , Issue , 2008, Pages 632-636

  Rodchanarowan, Aphichart ^a   Bhide, Ravindra ^a   Free, Michael L ^a  

^a UNIVERSITY OF UTAH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; HYDROMETALLURGY; MASS TRANSFER; METALLURGY;

CHLORIDE MEDIAS; MASS TRANSPORTS; NUCLEATION AND GROWTHS;

NUCLEATION;

EID: 56449122981     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (21)

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