Improving the morphology of copper electrodeposits from halide media using additives and mass transport control

ECS Transactions

Volumn 1, Issue 13, 2006, Pages 13-23

  Free, M L ^a   Bhide, R ^a   Rodchanarowan, A ^a  

^a UNIVERSITY OF UTAH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROCHEMISTRY; EXTRACTION; MASS TRANSFER; ORGANIC COMPOUNDS; SMELTING;

CHALCOPYRITE; DEPOSIT MORPHOLOGY; ELECTROWINNING;

COPPER;

EID: 33846075252     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2214593     Document Type: Conference Paper

References (21)

1. M. L. Free, Electrometallurgy 2001. ed. J. A. Gonzales, J. Dutrizac, CIM, Montreal, QC, Canada, 235, 2001.
2. R. F. Dalton, G. Diaz, R. Price, and A. D. Zunkel, Journal of Metals, August, 51, 1991.
3. P. R. Kruesi, E. S. Allen, J. L. Lake, CIM Bulletin, June, 81, 1973.
4. P. K. Everett, Reinhardt Schuhmann International Symposium on Innovative Technology and Reactor Design in Extraction Metallurgy. Warrendale, PA, USA; Mining & Metallurgical Inst of Japan, Jpn; Inst of Mining & Metallurgy; Verein Deutscher Eisenhuettenleute, Duesseldorf, West Ger; Technical Assoc for Iron & Steel Production; et al Metallurgical Soc of AIME, 727, 1986.
5. G. W. McDonald, H. Darus, S. H. Langer, Hydrometallurgy, 24, 291, 1990.
6. F. P. Haver, R. D. Baker, and M. M. Wong, Report of Investigations No. 8007, United States Department of the Interior Bureau of Mines, 1, 1975.
7. J. M. Demarthe, L. Gandon, and A. Georgeaux, United States Patent, No. 4288304, 8 September 1981.
8. C. Haakonsen, United States Patent, No. 4337128, 29 June 1982.
9. G. M. Ritcey, K. T. Price, and B. H. Lucas, United States Patent, No. 4362607, 7 December 1982.
10. D.V. Adamson and D. Naden, United States Patent, No. 4378275, 29 March 1983.
11. G. W. Clevenger, G. W. Pepple, United States Patent, No. 4384890, 24 May 1983.
12. D. P. Satchell, Jr., and J. N. Gerlach, United States Patent, No. 4594132, 10 June 1986.
13. H. D. Sawyer and R. W. Shaw, United States Patent, No. 4971662, 20 November 1990.
14. P. K. Everett, United States Patent, No. 5487819, 30 Jan 1996.
15. K. N. Han and X. Meng, United States Patent, No. 5989311, 23 November 1999.
16. M. Ileva, V. Tsakova, Electrochimica Acta, 50, 1669, 2005.
17. R. Winand, Transactions of the Institution of Mining and Metallurgy, Section C, 84(823), c67, 1975.
18. N. Pradhan, P. G. Krishna, S. C. Das, Plating and Surface Finishing, 83(3), 6, 1996.
19. R. Winand, Electrochimica Acta, 43, 2925, 1998.
20. P. A. Andrianne, J. P. Dubois, R. F. P. Winand, Metallurgical Transactions B, 8B, 315, 1977.
21. C. Gabrielli, P. Mocoteguy, H. Perrot, R. Wiart, J. of Electroanalytical Chemistry, 572, 367, 2004.