Electroforming of revolving parts with near-polished surface and uniform thickness

International Journal of Advanced Manufacturing Technology

Volumn 39, Issue 11-12, 2008, Pages 1164-1170

  Zhu, Zeng Wei ^a   Zhu, Di ^a   Qu, Ning Song ^a   Wang, Kun ^a   Yang, Jian Ming ^b  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b HUAIHAI INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Electroforming; Optimized anode; Polishing; Thin wall metal part

Indexed keywords

ELECTROCHEMISTRY; ELECTROMETALLURGY; FINITE ELEMENT METHOD; FORMING; HYDROGEN; SURFACE ROUGHNESS; TECHNOLOGY;

CATHODE SURFACES; HARD PARTICLES; HYDROGEN BUBBLES; OPTIMIZED ANODE; ORGANIC ADDITIVES; OUTER SURFACES; POLISHED SURFACES; SPACE BETWEEN; SURFACE SMOOTHNESSES; THICKNESS UNIFORMITIES; THIN-WALL METAL PART; THIN-WALLED; UNIFORM THICKNESSES;

ELECTROFORMING;

EID: 55649093577     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-007-1300-9     Document Type: Article

References (16)

1. JA McGeough MC Leu KP Rajurkar AKM De Silva Q Liu 2001 Electroforming process and application to micro/macro manufacturing Ann CIRP 50 2 499 514
2. SM Silaimani S John 2001 Review on recent advances in electroforming during the last decade Bull Electrochem 17 12 553 560
3. T Hart A Watson 2000 Electroforming Met Finish 98 388 399
4. John S, Veeramani P, Srinivasan KN (2000) Electroforming process for the fabrication of cryogenic rocket engine thrust chamber. ICEC 18, Mumbai, India, pp 675-678
5. GA DiBari 2004 Nickel plating Plating Surf Finish 91 8 23 26
6. D Monzon Mario M Dolores Marrero A Nizardo Benitez M Hernandez Pedro J Francisco Cardenes 2006 A technical note on the characterization of electroformed nickel shells for their application to injection molds J Mater Process Technol 176 273 277
7. L Mirkova G Maurin M Monev Chr Tsvetkova 2003 Hydrogen coevolution and permeation in nickel electroplating J Appl Electrochem 33 1 93 100
8. NS Qu KC Chan D Zhu 1997 Surface roughening in pulse current and pulse reverse current electroforming of nickel Surf Coat Technol 91 3 220 224
9. P Ram Sankar BQ Khattak AK Jain R Kaul P Ganesh AK Nath P Tiwari A Amban A Pagare 2005 Electroforming of copper by the periodic reversal process Surf Eng 21 3 204 208
10. WC Tsai CC Wan YY Wang 2002 Mechanism of copper electrodeposition by pulse current and its relation to current efficiency J Appl Electrochem 32 1371 1378
11. Kim Ingon F Mentone Pat 2006 Electroformed nickel stamper for light guide panel in LCD back light unit Electrochim Acta 52 1805 1809
12. H Yang SW Kang 2000 Improvement of thickness uniformity in nickel electroforming for the LIGA process Int J Mach Tools Manuf 40 1065 1072
13. http://cs.space.eads.net/sp/Production/SurfaceTechnologies/ NickelSulphamate.html
14. O Kardos 1974 Current distribution on microprofiles Plating 61 129 138
15. KP Rajukar D Zhu JA McGeough 1999 New developments of electrochemical machining Ann CIRP 48 2 569 579
16. ZW Zhu D Zhu NS Qu WN Lei 2007 Electrodeposition of bright nickel coating under perturbation of hard particles Mater Des 28 1776 1779