Electroforming of copper by the periodic reversal process

Surface Engineering

Volumn 21, Issue 3, 2005, Pages 204-208

  Sankar, P Ram ^a   Khattak, B Q ^a   Jain, A K ^a   Kaul, R ^a   Ganesh, P ^a   Nath, A K ^a   Tiwari, P ^a   Amban, A ^a   Pagare, A ^a  

^a RAJA RAMANNA CENTRE FOR ADVANCED TECHNOLOGY   (India)

Author keywords

Copper; Ductility; Electroforming; Grain growth; Passive interface; Periodic reversal; Texture and twin

Indexed keywords

ANNEALING; CURRENT DENSITY; DUCTILITY; ELECTROFORMING; GRAIN GROWTH; INTERFACES (MATERIALS); LININGS; MICROSTRUCTURE; PARAMETER ESTIMATION; PARTICLE ACCELERATORS; TEXTURES;

PASSIVE INTERFACES; PERIODIC REVERSAL; SMOOTH SURFACE; TEXTURE AND TWIN;

COPPER;

EID: 24144454157     PISSN: 02670844     EISSN: None     Source Type: Journal    
DOI: 10.1179/174329405X50028     Document Type: Article

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