Mechanical properties of 3C-SiC films for MEMS applications

Materials Research Society Symposium Proceedings

Volumn 1049, Issue , 2008, Pages 41-48

  Reddy, Jayadeep Deva ^a   Volinsky, Alex A ^a   Frewin, Christopher L ^a   Locke, Chris ^a   Saddow, Stephen E ^a  

^a University of South Florida   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIAMOND TIPS; ELASTIC CONTACTS; HARD THIN FILMS; HERTZIAN; HIGH ELASTIC MODULUS; HIGH TEMPERATURES; INDENTATION LOADS; MEMS APPLICATIONS; POLYCRYSTAL LINES; POLYCRYSTALLINE SIC; SI SUBSTRATES; SIC FILMS; SINGLE- AND POLY-CRYSTALLINE;

ABS RESINS; APPLICATIONS; COMPOSITE MICROMECHANICS; DIAMOND FILMS; DIAMONDS; ELASTIC MODULI; FILM GROWTH; FRACTURE TOUGHNESS; HARDNESS; MECHANICAL PROPERTIES; MEMS; MICROELECTROMECHANICAL DEVICES; NANOINDENTATION; NANOTRIBOLOGY; PHOTORESISTS; POWDERS; RECONNAISSANCE AIRCRAFT; SILICON; SILICON CARBIDE; SILICON WAFERS; SINGLE CRYSTALS; THICK FILMS; THIN FILMS;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 55249120922     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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