Microstructure of ECAE-processed copper after long-term room-temperature storage

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 39, Issue 12, 2008, Pages 2923-2930

  Mishin, O V ^a   Godfrey, A ^b  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DATA STORAGE EQUIPMENT; FORMING; MICROSTRUCTURE; RECRYSTALLIZATION (METALLURGY); ROTATION;

CENTER LINES; COPPER SAMPLES; DEFORMATION MICROSTRUCTURES; EQUAL CHANNEL ANGULAR EXTRUSIONS; MICROSTRUCTURAL CHARACTERIZATIONS; MICROSTRUCTURAL REFINEMENTS; PROCESSING ROUTES; RECRYSTALLIZED GRAINS; ROOM TEMPERATURES;

EXTRUSION;

EID: 55149122902     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-008-9658-3     Document Type: Article

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