Recrystallisation at ambient temperature of heavily deformed ETP copper wire

Scripta Materialia

Volumn 34, Issue 11, 1996, Pages 1667-1672

  Schamp, J ^a   Verlinden, B ^a   Van Humbeeck, J ^a  

^a UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; COPPER; DEFORMATION; IMPURITIES; MECHANICAL PROPERTIES; METALLOGRAPHIC MICROSTRUCTURE; METALLOGRAPHY; RECRYSTALLIZATION (METALLURGY); TEMPERATURE; TENSILE STRENGTH;

ELECTROLYTIC TOUGH PITCH COPPER WIRE; SPIRAL ELONGATION NUMBER;

WIRE;

EID: 0030174164     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/1359-6462(96)00034-6     Document Type: Article

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