Development of dicing technique for thin semiconductor substrates with femtosecond laser ablation

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5339, Issue , 2004, Pages 374-381

  Yokotani, Atsushi ^a   Mukumoto, Toru ^a   Mizuno, Toshio ^a   Kurosawa, Kou ^a   Kawahara, Kosuke ^b   Ninomiya, Takahumi ^b   Sawada, Hiroshi ^b  

^a UNIVERSITY OF MIYAZAKI   (Japan)

^b NEC CORPORATION   (Japan)

Author keywords

Dicing technique; Drilling process; Femtosecond laser; Image intensified CCD camera; Photo machining; Thermal effect; Thin silicon substrate; Time resolved imaging

Indexed keywords

CHARGE COUPLED DEVICES; INFORMATION TECHNOLOGY; LASER ABLATION; LASER BEAM EFFECTS; LASER PULSES; MICROMACHINING; THERMAL EFFECTS; THIN FILMS;

DICING TECHNIQUES; DRILLING PROCESS; FEMTOSECOND LASERS; IMAGE-INTENSIFIED CCD CAMERA; PHOTO-MACHINING; THIN SILICON SUBSTRATES; TIME RESOLVED IMAGING;

SEMICONDUCTOR MATERIALS;

EID: 5444255027     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.531677     Document Type: Conference Paper

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