Tuning the architectures of lead deposits on metal substrates by electrodeposition

Electrochimica Acta

Volumn 54, Issue 2, 2008, Pages 247-253

  Yao, Chen Zhong ^a   Liu, Meng ^a   Zhang, Peng ^a   He, Xiao Hui ^a   Li, Gao Ren ^a,b,c   Zhao, Wen Xia ^b   Liu, Peng ^a   Tong, Ye Xiang ^a,b  

^a MOE   (China)

^b SUN YAT SEN UNIVERSITY   (China)

^c Peking University   (China)

Author keywords

Electrodeposition; Lead; Nucleation; Octahedron; Zigzag nanowire

Indexed keywords

CHEMICAL VAPOR DEPOSITION; CONCENTRATION (PROCESS); DOPING (ADDITIVES); ELECTRODEPOSITION; LEAD; METALLIZING; MICROSCOPES; MORPHOLOGY; REDUCTION; SCANNING ELECTRON MICROSCOPY; SOLUTIONS; SUBSTRATES; TRANSMISSION ELECTRON MICROSCOPY; X RAY ANALYSIS;

AQUEOUS SOLUTIONS; AS-DEPOSITED; DEPOSITION CURRENTS; DEPOSITION TIME; ELECTRO-CHEMICAL DEPOSITION; ELECTRODEPOSITION CONDITIONS; METAL SUBSTRATES; NUCLEATION; OCTAHEDRON; SCANNING ELECTRON MICROSCOPE; SPACE GROUP; TRANSMISSION ELECTRON MICROSCOPE; ZIGZAG NANOWIRE;

LEAD DEPOSITS;

EID: 53649101144     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2008.08.005     Document Type: Article

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