Mechanical modeling of thin films and cover plates bonded to graded substrates

Journal of Applied Mechanics, Transactions ASME

Volumn 75, Issue 5, 2008, Pages 0511051-0511058

  Guler, Mehmet A ^a  

^a TOBB UNIVERSITY OF ECONOMICS AND TECHNOLOGY   (Turkey)

Author keywords

Contact stress; Cover plate; Functionally graded material; Stress intensity factor; Thin film

Indexed keywords

ASPHALT PAVEMENTS; INTEGRAL EQUATIONS; MOLECULAR BEAM EPITAXY; SPEED; STRENGTH OF MATERIALS; STRESS CONCENTRATION; STRESS INTENSITY FACTORS; SUBSTRATES; THICK FILMS; THIN FILMS;

CONTACT MECHANICS; CONTACT PROBLEMS; CONTACT STRESS; COVER PLATE; COVER PLATES; CRACK INITIATION AND PROPAGATION; ELASTIC CONTINUUM; FAR FIELDS; FILM PROCESSING; FILM STRESSES; FREE EDGES; FUNCTIONALLY GRADED MATERIAL; INTERFACIAL SHEAR STRESS; MATE RIAL PROPERTIES; MECHANICAL LOADINGS; MECHANICAL MODELLING; MODE II; NORMAL STRESSES; STRESS INTENSITY; STRESS INTENSITY FACTOR; TEMPERATURE EXCURSIONS; THIN FILM; UNIFORM TEMPERATURE;

STRESSES;

EID: 52649179955     PISSN: 00218936     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2936237     Document Type: Conference Paper

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