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Volumn 26, Issue 10, 2003, Pages 963-976

Thermoelastic analysis of interfacial stress and stress singularity between a thin film and its substrate

Author keywords

Boundary element method; Dissimilar materials; Interfacial stress; Singular integral; Stress singularity; Thermoelastic analysis; Thin film

Indexed keywords

BOUNDARY CONDITIONS; BOUNDARY ELEMENT METHOD; DISSIMILAR MATERIALS; INTEGRAL EQUATIONS; INTERFACES (MATERIALS); SUBSTRATES; SUPERCONDUCTING FILMS; THERMAL STRESS;

EID: 0242526892     PISSN: 01495739     EISSN: None     Source Type: Journal    
DOI: 10.1080/01495730306345     Document Type: Article
Times cited : (10)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.