Dynamic crack-tip stress and displacement fields under thermomechanical loading in functionally graded materials

Journal of Applied Mechanics, Transactions ASME

Volumn 75, Issue 5, 2008, Pages 0511011-0511017

  Lee, Kwang Ho ^b   Chalivendra, Vijaya Bhaskar ^c   Shukla, Arun ^a,d  

^a ASME

^b Kyungpook National University   (South Korea)

^c University of Massachusetts Dartmouth   (United States)

^d The University of Rhode Island   (United States)

Author keywords

Functionally graded materials; Isochromatics; Mixed mode; Stress intensity factors; Thermomechanical loading

Indexed keywords

CO-EFFICIENT OF THERMAL EXPANSION; DISPLACEMENT FIELDS; DISPLACEMENT POTENTIALS; EXPONENTIAL VARIATION; HEAT FLUX DISTRIBUTIONS; ISOCHROMATICS; LOADING CONDITIONS; MASS DENSITIES; MAXIMUM SHEAR STRESS; MIXED MODE; MIXED-MODE LOADING; MODE-MIXITY; PROPAGATING CRACK; SHEAR MODES; SHEAR MODULUS; STRESS FIELDS; STRESS INTENSITY FACTORS; THERMOMECHANICAL LOADING;

ASYMPTOTIC ANALYSIS; BEAMS AND GIRDERS; CRACK INITIATION; CRACK PROPAGATION; CRACK TIPS; FORMING; FRACTURE; PLATES (STRUCTURAL COMPONENTS); STEEL STRUCTURES; THERMAL EXPANSION; THERMAL SPRAYING; THERMOELECTRICITY; THERMOMECHANICAL TREATMENT;

FUNCTIONALLY GRADED MATERIALS;

EID: 52649154157     PISSN: 00218936     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2932093     Document Type: Conference Paper

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