Thermal design methodology for an embedded power electronic module using double-sided microchannel cooling

Journal of Electronic Packaging

Volumn 130, Issue 3, 2008, Pages 0310031-03100311

  Mital, Manu ^a   Scott, Elaine P ^b  

^a Virginia Commonwealth University   (United States)

^b SEATTLE PACIFIC UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ECONOMIC AND SOCIAL EFFECTS; ELECTRONIC COOLING; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HEAT SINKS; LAMINAR FLOW; STRUCTURAL DESIGN; THERMAL CONDUCTIVITY; THERMAL MANAGEMENT (ELECTRONICS);

DESIGN CONFIGURATIONS; DESIGN METHODOLOGY; DIRECT BONDED COPPERS; DOUBLE SIDED; DOUBLE-SIDED COOLING; INTEGRATED POWER ELECTRONIC MODULES; MODULE STRUCTURE; PARALLEL CHANNEL; POWER ELECTRONICS MODULES; THERMAL DESIGNS;

MICROCHANNELS;

EID: 52649110681     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2957320     Document Type: Article

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