Nanoindentation hardness, Young's modulus, and creep behavior of organic-inorganic silica-based sol-gel thin films on copper

Journal of Materials Research

Volumn 23, Issue 9, 2008, Pages 2357-2365

  Latella, Bruno A ^a   Gan, Bee K ^a   Barbé, Christophe J ^a   Cassidy, David J ^a  

^a AUSTRALIAN NUCLEAR SCIENCE AND TECHNOLOGY ORGANISATION   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CREEP; ELASTIC MODULI; ELASTICITY; GELATION; GELS; MECHANICAL PROPERTIES; NANOINDENTATION; ORGANIC COATINGS; SILANES; SILICA; SILICATE MINERALS; SILICON COMPOUNDS; SOL-GEL PROCESS; SOL-GELS; SOLS; THICK FILMS;

CHAIN LENGTHS; COPPER SUBSTRATES; CREEP BEHAVIORS; CREEP DATA; CREEP PROPERTIES; CREEP RESPONSES; FILM STRUCTURES; GLYCIDOXY PROPYL TRIMETHOXY SILANE; HYBRID SOL GELS; MECHANICAL MODELLING; NANO-INDENTATION HARDNESS; NANOINDENTATION EXPERIMENTS; ORGANIC SUBSTITUENTS; ORGANIC-INORGANIC; ORGANICALLY MODIFIED SILANES; SOL-GEL PROCESSING; SOL-GEL THIN FILMS; TETRA ETHOXY SILANE; VINYL TRIMETHOXYSILANE; YOUNG'S MODULUS;

COLLOIDS;

EID: 52649093430     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2008.0315     Document Type: Article

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