Fabrication of vertical comb electrodes using selective anodic bonding

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2007, Pages 349-352

  Lee, Sangwoo ^a   Cho, Jaeyoong ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL SENSORS; COMPOSITE MICROMECHANICS; ELECTROCHEMICAL ELECTRODES; ELECTRODES; GLASS; MECHANICAL ENGINEERING; MECHANICS; MECHATRONICS; MEMS; METALLIZING; MICROCRYSTALLINE SILICON; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; NONMETALS; OPTICAL DESIGN; REACTIVE ION ETCHING; SILICON; SILICON WAFERS;

ANODIC BONDING; DOWN FORCE; FABRICATION TECHNOLOGIES; GLASS WAFERS; INTERNATIONAL CONFERENCES; MECHANICAL STIFFNESS; MICRO-ELECTRO MECHANICAL SYSTEMS; OUT-OF PLANE; OUT-OF-PLANE MOTION; SENSORS AND ACTUATORS; SILICON-ON-GLASS; VERTICAL COMB; VERTICAL COMB ELECTRODES;

PHOTORESISTS;

EID: 52249110176     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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