Integrated peristaltic 18-stage electrostatic gas micro pump with active microvalves

Technical Digest - Solid-State Sensors, Actuators, and Microsystems Workshop

Volumn , Issue , 2006, Pages 292-295

  Kim, Hanseup ^a   Astle, Aaron A ^a   Najafi, Khalil ^a   Bernal, Luis P ^a   Washabaugh, Peter D ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Active microvalves; Electrostatic pump; Micro gas pump; Peristlatic pump

Indexed keywords

ACTUATORS; ELECTROSTATICS; MICROSYSTEMS; SOLID-STATE SENSORS; VALVES (MECHANICAL);

DUAL ELECTRODES; FULLY INTEGRATED; MAXIMUM PRESSURE; MICRO GAS PUMP; MICRO VALVES; TIMING CONTROL; TOTAL PRESSURE; VOLUME DISPLACEMENTS;

PUMPS;

EID: 52249094827     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. G. C. Frye-Mason et.al, "Microfabricated gas phase chemical analysis systems," Microprocesses and Nanotechnology Conference, pp. 60-61, 1999.
2. E. Zellers et.al., "A versatile MEMS gas chromatograph for determinations of environmental vapor mixtures," Hilton Head '04, Hilton Head Island, SC, pp. 61-66, 2004.
3. A. Astle, A. Paige, L. P. Bernal, J. Munfakh, H. Kim, and K. Najafi, "Analysis and design of multistage electrostatically-actuated micro vacuum pumps," ASME IMECE, 2002-39308.
4. R. Zengerle, A. Richter, and H. Sandmaier, "A micro membrane pump with electrostatic actuation," MEMS '92, Travemunde, Germany, pp. 19-24, 1992.
5. M. Stehr, H. Gruhler, H. Straatmann, S. Messner, H. Sandmaier, and R. Zengerle, "The selfpriming VAMP," Transducers '97, Chicago, pp. 351-352, 1997.
6. H. Kim, K. Najafi, A. Astle, L. Bernal, and P. Washabaugh, "Fabrication and performance of a dual-eledctrode electrostatic peristaltic gas micropump," µTAS '05, pp. 1173-1176, pp. 2005.
7. H. Kim and K. Najafi, "Wafer bonding using Parylene and wafer-level transfer of free-standing Parylene membranes," Transducers '03, Boston, MA, USA, pp. 790-793, 2003.
8. H. Kim and K. Najafi, "Characterization of a low-temperature wafer bonding using thin film Parylene," IEEE Journal of Microelectromechanical Systems (JMEMS), vol. 14, no. 6, pp. 1347-1355, 2005.