A novel electromagnetic band-gap structure for ultra-wide band suppression of ground bounce noise

Asia-Pacific Microwave Conference Proceedings, APMC

Volumn , Issue , 2007, Pages

  Xu, Xiaofei ^a   Zhao, Junming ^a   Feng, Yijun ^a  

^a NANJING UNIVERSITY   (China)

Author keywords

Electromagnetic bandgap (EBG); Ground bounce noise (GBN); Signal integrity (SI); Simultaneously switching noises (SSN)

Indexed keywords

GALLIUM ALLOYS; LOUDSPEAKERS; MAGNETIC MATERIALS; MICROWAVES; POLARIZATION; RELIABILITY; SEMICONDUCTOR MATERIALS; SIGNAL PROCESSING; TRANSCEIVERS;

ASIA-PACIFIC; DIFFERENTIAL PAIRS; EBG STRUCTURES; ELECTROMAGNETIC BAND-GAP STRUCTURES; ELECTROMAGNETIC BANDGAP (EBG); FULL-WAVE SIMULATIONS; GROUND BOUNCE NOISE; GROUND BOUNCE NOISE (GBN); HIGH-SPEED CIRCUITS; MEAS URED RESULTS; MICRO STRIPS; RING SLOTS; SIGNAL INTEGRITY (SI); SIGNAL-INTEGRITY; SIMULTANEOUSLY SWITCHING NOISES (SSN); ULTRA WIDE BANDS;

ELECTROMAGNETISM;

EID: 51849127787     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APMC.2007.4555080     Document Type: Conference Paper

References (14)

1. S. Van den Berghe, F. Olyslager, D. De Zutter, J. De Moerloose, and W. Temmerman, "Study of the ground boune caused by power planes resonance," IEEE Trans. Electromagn. Compat, Vol. 40, pp. 111-119, May 1998.
2. B. Archambeault and A. Ruehli, Analysis of power /ground plane EMI decoupling performance uising the partial element equivalent circuit technique, IEEE Trans. Electromagn Compat, vol. 43, pp. 437-445, Nov. 2001.
3. Ricchiuti, "Power supply decoupling on fully populated high-speed digital PCBs," IEEE Trans. Electromagn Compat, vol, 43, pp. 671-676, Nov. 2001.
4. T. L. Wu, S. T. Chen, J. N. Huang, and Y. H. Lin, "Numerical and experimental investigation of radiation caused by the switching noise on the partitioned dc reference planes of high speed digital PCB," IEEE Trans. Electromagn Compat, vol, 46, pp. 33-45, Feb. 2004.
5. Ramesh Abhari, George V. Eleftheriades, "Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits," IEEE Trans. MTT, vol. 51, pp. 1629-1639, Jun. 2003.
6. Shahrooz Shahparnia, Omar M. Ramahi, "Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures," IEEE Trans. Electromagn. Compat, vol. 46, pp (2004), 580-586, Nov. 2004.
7. Telesphor Kamgaing, Omar M. Ramahi, "A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface," IEEE Trans. Microwave and wireless compon. Lett, vol. 13, pp. 21-23, Jan. 2003.
8. Tzong-Lin Wu, Yen-Hui Lin, Ting-Kuang Wang, Chicn-Chung Wang and Sin-Ting Chen, "Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits," IEEE Trans. MTT, vol. 53, pp. 2935-2942, Sep. 2005.
9. T.-L. Wu, Y.-H. Lin, and S.-T. Chen, "A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures," IEEE Trans. Microwave and Wireless Compon. Lett, vol. 14, pp. 337-339, Jul. 2004.
10. Jinwoo Choi, V. Govind, M. swaminathan, "Noise suppression in ultrawide band (UWB) applications using alternating impedance electromagnetic bandgap (AI-EBG) structures," 2005 EURAD,Paris, France, pp. 295-298, Oct. 2005.
11. Xiao-Hua Wang, Bing-Zhong Wang, Ye-Hai Bi, and Wei Shao, "A Novel Uniplanar Compact Photonic Bandgap Power Plane With Ultra-Broadband Suppression of Ground Bounce Noise," IEEE Trans. Microwave and Wireless Compon. Lett., vol. 16, pp. 267-268, May 2006.
12. Jie Qin, and Omar M. Ramahi, "Ultra-Wideband Mitigation of Simultaneous Switching Noise Using Novel Planar Electromagnetic Bandgap Structures," IEEE Tran. Microwave and Wireless Compon. Lett., vol. 16, pp. 487-489, Sep. 2006.
13. P. Zhou, J. M. Zhao, and Y. J. Feng, "A Self-similar fractal Electromagnetic Bandgap Structure in the Power Plane with Broadband Suppression of Ground Bounce Noise," Microw. Opt. Tech. Lett. Vol. 49, pp. 190-192, Jan. 2007.
14. Y. H. Lin and T. L. Wu, "Investigation of signal quality and radiated emission of microstrip line on imperfect ground plane: FDTD analysis and measurement," in Proc. IEEE Int. Symp. Electromagn. Compat.,Montreal, QC, Canada, pp. 319-324, Aug. 2001.