Microchip reuse: Environmental rationale and design implications

IEEE International Symposium on Electronics and the Environment

Volumn , Issue , 2008, Pages

  Geyer, R ^a   Oliver, J ^a   Amirtarajah, R ^a   Akella, V ^a   Chong, F T ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 51849087377     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISEE.2008.4562926     Document Type: Conference Paper

References (7)

1. E.D. Williams et al., "The 1.7 Kilogram Microchip: Energy and Material Use in the Production of Semiconductor Devices, " Environmental Science and Technology, vol. 36, no. 24, 2002, pp. 5504-5510.
2. H.B. Bakoglu, Circuits, Interconnections, and Packaging for VLSI, Addison-Wesley, 1990.
3. International Technology Roadmap for Semiconductors: 2005 Edition- System Drivers, ITRS, 2005.
4. L.T. Clark et al., "Standby Power Management for a 0.18 μm Microprocessor," Proc. 2002 Int'l Symp. Low Power Electronics and Design, ACM Press, 2002, pp. 7-12.
5. Directive 2002/95/EC on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, Official J. European Union, vol. 37, 2003, pp. 19-23.
6. Directive 2002/96/EC on Waste Electrical and Electronic Equipment (WEEE), Official J. European Union, vol. 37, 2003, pp. 24-38.
7. J. Y. Oliver et al., "Life Cycle Aware Computing: Reusing Silicon Technology," Computer 40(12) pp. 56-61.