IC-EMC, a demonstration freeware for predicting electromagnetic compatibility of integrated circuits

2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008

Volumn , Issue , 2008, Pages 16-19

  Boyer, A ^a   Sicard, E ^a   Dhia, S Ben ^a  

^a UNIVERSITÉ DE TOULOUSE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC INVERTERS; INTEGRATED CIRCUITS; MAGNETIC MATERIALS; PLASTIC MOLDS;

ASIA-PACIFIC; PARASITIC EMISSIONS;

ELECTROMAGNETIC COMPATIBILITY;

EID: 51749095502     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APEMC.2008.4559800     Document Type: Conference Paper

References (15)

1. S. Ben Dhia, M. Ramdani, E. Sicard, Electromagnetic Compatibility of Integrated Circuits, Springer, 2005, ISBN 0-387-26600-3
2. The latest version of the IC-EMC software may be downloaded from www.ic-emc.org.
3. E. Sicard, A. Boyer "IC-EMC vl.5 User's Manual", INSA editor, ISBN 978-2-87649-052-9, 160 pp
4. The analog simulation tool WinSPICE may be downloaded from www.winspice.com.
5. IEC 61967: «lntegrated circuits, measurement of electromagnetic emission up to 1 GHz », www.iec.ch
6. IBIS v2.1: IEC 62014-1: « Electronic behavioural specifications of digital integrated circuits I/O Buffer Information Specification », http://www.eigroup.org/ibis.
7. IEC 62433: « Models of Integrated Circuits for EMI behavioral simulation - ICEM » - July 2005, www.iec.ch
8. IEC 61967-4: « Integrated circuits, measurement of conducted emission, 1 Ω/150 Ω method », www.iec.ch
9. K. P. Slattery, J. W. Neal, W. Cui, « Near-Field Measurement of VLSI Devices », IEEE Transactions on Electromagnetic Compatibility, vol. 41, no 4, November 1999
10. IEC 61967-3: «lntegrated circuits, measurement of radiated emissions, surface scan method », www.iec.ch
11. S. Ben Dhia, C. Lochot, C. Labussière, « 16-bit Microcontroller Measurements and Modeling using different Approaches », EMC Compo 05, Munich, 28 - 30 November 2005
12. IEC 62132: « Integrated circuits, measurement of electromagnetic immunity up to 1 GHz », www.iec.ch
13. A. Boyer, S. Bendhia, E. Sicard, « Modeling of a Direct Power Injection Aggression on a 16 bit Microcontroller Input Buffer », EMC Compo 07, Turin, 28 - 20 November 2007
14. Sudo T., Sasaki H., « Electromagnetic Interference of System-On-Package », IEEE Transactions on Advanced Packaging, vol. 27, no. 2, May 2004.
15. A. Boyer, S. A. Boulingui, S. Bendhia, E. Sicard, S. Baffreau, « A ethodology for predicting Disturbances due to Near Field Chip to Chip Coupling », EMC Compo 07, Turin, 28 - 20 November 2007