Microstructural characterization of TLPD bonded 6061-SiCp composite

Journal of Materials Engineering and Performance

Volumn 17, Issue 5, 2008, Pages 746-754

  Maity, Joydeep ^a   Pal, Tapan K ^b   Maiti, Rabindranath ^c  

^a NATIONAL INSTITUTE OF TECHNOLOGY   (India)

^b JADAVPUR UNIVERSITY   (India)

^c INDIAN INSTITUTE OF TECHNOLOGY   (India)

Author keywords

AlMMC; Isothermal solidification; Process kinetics; TLPD bonding

Indexed keywords

ALMMC; ISOTHERMAL SOLIDIFICATION; MICROSTRUCTURAL DEVELOPMENTS; PROCESS KINETICS; TLPD BONDING;

ALUMINA; COPPER; MICROSCOPIC EXAMINATION; REINFORCEMENT; SECONDARY EMISSION; SILICON CARBIDE;

METALLIC MATRIX COMPOSITES;

EID: 51549086794     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11665-008-9211-y     Document Type: Article

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