Thermal and structural simulation techniques for estimating fatigue life of an IGBT module

Proceedings of the International Symposium on Power Semiconductor Devices and ICs

Volumn , Issue , 2008, Pages 181-184

  Sasaki, Koji ^a   Iwasa, Naoko ^a   Kurosu, Toshiki ^a   Saito, Katsuaki ^a   Koike, Yoshihiko ^a   Kamita, Yukio ^a   Toyoda, Yasushi ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE FILTERS; ALUMINA; ELECTRIC CONDUCTIVITY; FRACTURE MECHANICS; POWER ELECTRONICS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR MATERIALS; SEMICONDUCTOR SWITCHES; STRENGTH OF MATERIALS; THERMOANALYSIS;

FATIGUE-LIFE; INTERNATIONAL SYMPOSIUM; POWER SEMICONDUCTOR DEVICES;

SEMICONDUCTOR DEVICES;

EID: 51549086505     PISSN: 10636854     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISPSD.2008.4538928     Document Type: Conference Paper

References (4)

1. T. Matsunaga and Y. Uegai, "Thermal fatigue life evaluation of aluminum wire bonds," Electronics System Integration Technology Conference, 2006. 1st, Vol. 2, pp. 726-731, Sept. 2006.
2. S. Ramminger, N. Seliger, and G. Wachutka, "Reliability model for Al wire bonds subjected to heel crack failures," Microelectronics Reliability, Volume 40, Issues 8-10, pp. 1521-1525, August-October 2000.
3. M. Held, P. Jacob, G. Nicoletti, P. Scacco, and M.-H. Poech, "Fast power cycling test of IGBT modules in traction application," Power Electronics and Drive Systems, 1997. Proceedings., Vol. 1, pp. 425-430, May 1997.
4. S. Usami, M. Horino, A. Yasukawa, and K. Kanai, "Inelastic behavior and fatigue crack initiation and growth in solders," Quarterly Journal of the Japan Welding Society, Vol. 19, No. 3, pp. 521-536, Aug. 2001.