Inelastic behavior and fatigue crack initiation and growth in solders

Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society

Volumn 19, Issue 3, 2001, Pages 521-536

  Usami, S ^a   Horino, M ^a   Yasukawa, A ^a   Kanai, K ^a  

^a HITACHI LTD   (Japan)

Author keywords

Crack growth; Crack initiation; Creep fatigue; Solder; Strain intensity factor; Stress relaxation; Thermal fatigue

Indexed keywords

COMPUTER SIMULATION; CRACK INITIATION; CRACK PROPAGATION; CREEP; ELASTICITY; FATIGUE OF MATERIALS; MICROCRACKS; STRAIN RATE; STRESS ANALYSIS; STRESS INTENSITY FACTORS; STRESS RELAXATION;

STRAIN INTENSITY FACTORS; THERMAL FATIGUE;

SOLDERING ALLOYS;

EID: 0035415646     PISSN: 02884771     EISSN: None     Source Type: Journal    
DOI: 10.2207/qjjws.19.521     Document Type: Article

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