Fracture behaviour of adhesive bonds by different shear speed

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1679-1683

  Paproth, A ^a   Walter, S ^a   Wolter, K J ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; BUILDING MATERIALS; COMPUTER NETWORKS; ELECTRONICS PACKAGING; PHOTORESISTS; POLYMERS; SPEED;

ELECTRONIC COMPONENTS; ELECTRONIC PACKAGING; ENVIRONMENTALLY-FRIENDLY; SHEAR SPEED;

GLASS TRANSITION;

EID: 51349167386     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550204     Document Type: Conference Paper

References (9)

1. Rösier, J.; Harders, H.; Baker, M.: Mechanisches Verhalten der Werkstoffe. B.G. Teubner Verlag, Wiesbaden 2006
2. Habenicht, G: Kleben - Grundlagen, Technologie, Anwendungen: 3. Auflage, Springer Verlag 1997 Berlin-Heidelberg
3. Song, F.; Lee, S. W. R.; Newman, K.; Sykes, B.; Clark,S.: "High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed"; The 57th Electronic Components and Technology Conference, May 29 - June 1,2007 Reno, Nevada USA
4. JESD22-B110 (Ausgabe 2004-11), Subassembly Mechanical Shock
5. JESD22-B117 (Ausgabe:2000-07), BGA Ball Shear
6. JESD22-B111 (Ausgabe:2003-07), Board Level Drop Test Method of Components for Handheld Electronic Products
7. Holzmüller, W.; Altenburg, K.: Physik der Kunststoffe. Akademie-Verlag Berlin 1961
8. DIN EN ISO 10365 (Ausgabe 1995-08); Klebstoffe -Bezeichnung der wichtigsten Bruchbilder
9. Song, F.; Lee, S. W. R.; Newman, K.; Sykes, B.; Clark,S.: Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls during High Speed Ball Shear and Cold Ball Pull Tests, The 57th Electronic Components and Technology Conference, May 29 - June 1, 2007 Reno, Nevada USA.