Board Level Reliability Evaluation of RF PA Module Vias

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2003, Pages 305-311

  Darveaux, Robert ^a   Yang, Jicheng ^a   Syed, Ahmer ^a   Buella, Boy ^b   Villareal, Paul ^b   Kang, W J ^b  

^a AMKOR TECHNOLOGY   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

LAMINATES; PRINTED CIRCUIT BOARDS; ROBUSTNESS (CONTROL SYSTEMS); SOLDERED JOINTS; THERMAL EFFECTS; BUILDING MATERIALS; CHAINS; CHIP SCALE PACKAGES; COREMAKING; CRACKS; FAILURE ANALYSIS; INDUSTRIAL ELECTRONICS; MANUFACTURE; MATERIALS TESTING; MODULAR CONSTRUCTION; PACKAGING; PACKAGING MATERIALS; RADIO FREQUENCY AMPLIFIERS; RELIABILITY; TEMPERATURE MEASUREMENT; TESTING;

TEMPERATURE CYCLING;

FAILURE ANALYSIS; SUBSTRATES;

BOARD LEVEL TESTING; BOARD-LEVEL RELIABILITY; CRACK INITIATION SITES; LEG; QUALIFICATIONS; RADIO FREQUENCIES; TEMPERATURE CYCLES; TEMPERATURE CYCLING;

EID: 0141676764     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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2. B. Mirman, "Mathematical Model of Plated-Through-Hole Structure Under a Load Induced by Thermal Mismatch," International Thermal Conference, 1988.
3. S. Fauser, C. Ramirex, L. Cartwrigt," Plated Through Hole Reliabilty in Printed Curcuit Boards Which Utilize Direct Power / Ground Plane Interconnection," International Journal of Microcircuits and Electronic Packaging, Volume 17, Number 2, Second Quarter 1994, pp. 127-134.
4. B. Ozmat, "A Nonlinear Thermal Stress Analysis of the Plated Through Holes of Printed Wiring Boards," Proc International Electronic Packaging Society Conference, 1990, pp. 359-381.
5. T. Young, F. Polakovic, M. Carano, "Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing," Proc IPC Printed Circuits Expo, 2000, pp. S09-6-1 to S09-6-10.
6. R. Darveaux, J. Yang, R. Sheriden, B. Buella, P. Villareal, "RF PA Module Substrate Via Reliability," Proc. ECTC, 2003.