Design optimization on the heat transfer and mechanical reliability of High Brightness Light Emitting Diodes (HBLED) package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 798-803

  Gao, Shan ^a   Hong, Jupyo ^a   Shin, Sanghyun ^a   Lee, Yongki ^a   Choi, Seogmoon ^a   Yi, Sung ^a  

^a Samsung Electro Mechanics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS; HEAT EXCHANGERS; HEAT TRANSFER; HEATING EQUIPMENT; LIGHT EMITTING DIODES; MATERIALS SCIENCE; OPTICAL PROPERTIES; OPTIMIZATION; THERMOANALYSIS;

ELECTRONIC COMPONENTS; THERMAL RESISTANCE;

FINITE ELEMENT METHOD;

EID: 51349154799     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550066     Document Type: Conference Paper

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