Electrostatic latching for inter-module adhesion, power transfer, and communication in modular robots

IEEE International Conference on Intelligent Robots and Systems

Volumn , Issue , 2007, Pages 2779-2786

  Karagozler, M E ^a   Campbell, J D ^b   Fedder, G K ^a   Goldstein, S C ^c   Weller, M P ^d   Yoon, B W ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

^b INTEL CORPORATION   (United States)

^c Carnegie Mellon University

^d CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTER-MODULE; INTERNATIONAL CONFERENCES;

ADHESION; COMPUTER NETWORKS; ELECTRIC FIELD EFFECTS; ELECTRIC FIELDS; ELECTRODES; ELECTROSTATICS; INTELLIGENT ROBOTS; MACHINERY; MODULAR ROBOTS; PHOTOLITHOGRAPHY; ROBOTICS;

ROBOTS;

EID: 51349138309     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IROS.2007.4399492     Document Type: Conference Paper

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