Laser processing of 3-D structures for embedded and integrated components: An application of flexible and printable nanomaterials in microelectronics

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 444-451

  Das, Rabindra N ^a   Egitto, Frank D ^a   Antesberger, Timothy E ^a   Marconi, Francesco ^a   Lin, How ^a   Lauffer, John M ^a   Markovich, Voya R ^a  

^a Endicott Interconnect Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D STRUCTURES; ELECTRONIC COMPONENTS; LASER PROCESSING; NANO-MATERIALS;

ABS RESINS; BIMETALS; CAPACITANCE; CAPACITORS; CHEMICAL SENSORS; COLLOIDS; COMPOSITE MICROMECHANICS; COMPUTER NETWORKS; COPPER; DIELECTRIC DEVICES; ELECTRIC CONNECTORS; ELECTRIC EQUIPMENT; FILM PREPARATION; GELATION; GELS; LASERS; MACHINING; MICROELECTRONICS; MICROMACHINING; MULTILAYERS; NANOCOMPOSITES; NANOSTRUCTURED MATERIALS; POLYMER FILMS; POLYMER MATRIX COMPOSITES; SOL-GEL PROCESS; SOL-GELS; SOLS; THICK FILMS; THIN FILMS;

NEODYMIUM LASERS;

EID: 51349122120     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550010     Document Type: Conference Paper

References (9)

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