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Volumn , Issue , 2008, Pages 50-51

High heat flux thermal management of microfabricated upper millimeter-wave vacuum electronic devices

Author keywords

DRIE; LIGA; Microchannel cooler

Indexed keywords

DRIE; LIGA; MICROCHANNEL COOLER; VACUUM ELECTRON SOURCES; VACUUM ELECTRONICS;

EID: 51349102193     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IVELEC.2008.4556410     Document Type: Conference Paper
Times cited : (7)

References (3)
  • 2
    • 29244450854 scopus 로고    scopus 로고
    • Simulations of Direct Die Attached MicroChannel Coolers for the Thermal Management of GaN-on-SiC Microwave Amplifiers
    • Calame, J. P., Myers, R. E., Wood, F. N., and Binari, S. C., "Simulations of Direct Die Attached MicroChannel Coolers for the Thermal Management of GaN-on-SiC Microwave Amplifiers," IEEE Trans. Components and Packaging Technologies, vol. 28, pp. 797-809, 2005.
    • (2005) IEEE Trans. Components and Packaging Technologies , vol.28 , pp. 797-809
    • Calame, J.P.1    Myers, R.E.2    Wood, F.N.3    Binari, S.C.4
  • 3
    • 0032627447 scopus 로고    scopus 로고
    • Applications of Advanced Materials Technologies to Vacuum Electronic Devices
    • Calame, J. P., and Abe, D. K., "Applications of Advanced Materials Technologies to Vacuum Electronic Devices," Proc. IEEE, vol. 87, pp. 840-864, 1999
    • (1999) Proc. IEEE , vol.87 , pp. 840-864
    • Calame, J.P.1    Abe, D.K.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.