Hierarchical modeling of heat transfer in silicon-based electronic devices

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 1006-1017

  Goicochea, Javier V ^a   Madrid, Marcela ^b   Amon, Cristina ^c  

^a CARNEGIE MELLON UNIVERSITY   (United States)

^b PITTSBURGH SUPERCOMPUTING CENTER   (United States)

^c UNIVERSITY OF TORONTO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

BOLTZMANN EQUATION; BOUNDARY CONDITIONS; CARBON FIBER REINFORCED PLASTICS; CIVIL AVIATION; DYNAMICS; ELECTRONICS ENGINEERING; FIGHTER AIRCRAFT; FORMING; HEAT EXCHANGERS; HEAT TRANSFER; HEATING EQUIPMENT; HIERARCHICAL SYSTEMS; INTEGRATION; MOLECULAR DYNAMICS; PHONONS; QUALITY ASSURANCE; QUANTUM CHEMISTRY; RELIABILITY ANALYSIS; SILICON; THERMODYNAMIC PROPERTIES; THERMOELECTRIC EQUIPMENT; THERMOELECTRICITY; THERMOMECHANICAL TREATMENT;

HIERARCHICAL MODELLING;

RELIABILITY;

EID: 51149118652     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544376     Document Type: Conference Paper

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