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Volumn , Issue , 2008, Pages 815-821

Power cycle fatigue reliability evaluation for power device using coupled electrical-thermal-mechanical analysis

Author keywords

FEM analysis; Power cycle; Power device; Reliability evaluation; Thermal fatigue

Indexed keywords

AUTOMOBILE ELECTRONIC EQUIPMENT; CRACKS; ELECTRIC CURRENTS; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; JOULE HEATING; RELIABILITY ANALYSIS; TEMPERATURE DISTRIBUTION; THERMAL CYCLING; THERMAL EXPANSION; WIRE;

EID: 50949134139     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544351     Document Type: Conference Paper
Times cited : (16)

References (11)
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    • Robust thermal design for power device package using response surface method and Monte Carlo simulation
    • Yasuyuki Yokono, Katsumi Hisano, Kenji Hirohata, "Robust thermal design for power device package using response surface method and Monte Carlo simulation" Proceedings of HT2007, HT2007-32168.
    • Proceedings of HT2007, HT2007-32168
    • Yokono, Y.1    Hisano, K.2    Hirohata, K.3
  • 4
    • 33750289941 scopus 로고    scopus 로고
    • Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling
    • Hua Ye, Harry Efstathiadis, Pradeep Haldar "Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling," Journal of Electronic Packaging, 2006, vol.128, p.267
    • (2006) Journal of Electronic Packaging , vol.128 , pp. 267
    • Ye, H.1    Efstathiadis, H.2    Haldar, P.3
  • 5
    • 84983273084 scopus 로고    scopus 로고
    • Evaluation of Temperature Distribution of a Power Semiconductor Chip Using Electrothermal Simulation
    • Osamu Usui, Hirotaka Muto, Toshiyuki Kikunaga, "Evaluation of Temperature Distribution of a Power Semiconductor Chip Using Electrothermal Simulation," IEEJ Trans. IA, vol.124, no.1, 2004, pp.108-115
    • (2004) IEEJ Trans. IA , vol.124 , Issue.1 , pp. 108-115
    • Usui, O.1    Muto, H.2    Kikunaga, T.3
  • 6
    • 50049089668 scopus 로고    scopus 로고
    • Study on Thermal Performance of Lead Frame Interconnection to Power Devices
    • Yoshinari Ikeda, Kasuhiko Yoshihara, Yuji Iizuka, Mitsuo Yamashita "Study on Thermal Performance of Lead Frame Interconnection to Power Devices," JSME annual meeting 2004(6), pp.67-68
    • (2004) JSME annual meeting , vol.6 , pp. 67-68
    • Ikeda, Y.1    Yoshihara, K.2    Iizuka, Y.3    Yamashita, M.4
  • 7
    • 50049130373 scopus 로고    scopus 로고
    • Thermal Problem of Next Generation Semiconductor Power Devices
    • Hideki Iwasaki, Katsumi Hisano, Tomonao Takamatsu "Thermal Problem of Next Generation Semiconductor Power Devices," JSME annual meeting 2003(6), pp.251-252
    • (2003) JSME annual meeting , vol.6 , pp. 251-252
    • Iwasaki, H.1    Hisano, K.2    Takamatsu, T.3
  • 9
    • 50049093410 scopus 로고    scopus 로고
    • Assembly Technology Using Lead-free Solder
    • Tadanobu Matsumura, Tsuyoshi Yamamoto "Assembly Technology Using Lead-free Solder," FUJITSU, vol.56, no.6, 2005, pp.545-551
    • (2005) FUJITSU , vol.56 , Issue.6 , pp. 545-551
    • Matsumura, T.1    Yamamoto, T.2
  • 10
    • 0003820947 scopus 로고    scopus 로고
    • National Astronomical Observatory of Japan, Maruzen, Japan
    • National Astronomical Observatory of Japan, "Chronological Scientific Tables," Maruzen, Japan, 2006
    • (2006) Chronological Scientific Tables


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.