-
1
-
-
40449112154
-
Reliability of power electronic modules
-
H.Lu, W.S.Loh, T.Tilford, M.Johnson, C.Bailey "Reliability of power electronic modules" Proceedings of Inter PACK'07, IPACK2007-33813
-
Proceedings of Inter PACK'07, IPACK2007-33813
-
-
Lu, H.1
Loh, W.S.2
Tilford, T.3
Johnson, M.4
Bailey, C.5
-
2
-
-
43449094997
-
Robust thermal design for power device package using response surface method and Monte Carlo simulation
-
Yasuyuki Yokono, Katsumi Hisano, Kenji Hirohata, "Robust thermal design for power device package using response surface method and Monte Carlo simulation" Proceedings of HT2007, HT2007-32168.
-
Proceedings of HT2007, HT2007-32168
-
-
Yokono, Y.1
Hisano, K.2
Hirohata, K.3
-
3
-
-
50049101092
-
-
Akira Morozumi, Katsumi Yamada, Tadashi Miyasaka, Fuji electric journal, vol.74, no.2, 2001, pp.145-148
-
(2001)
Fuji electric journal
, vol.74
, Issue.2
, pp. 145-148
-
-
Morozumi, A.1
Yamada, K.2
Miyasaka, T.3
-
4
-
-
33750289941
-
Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling
-
Hua Ye, Harry Efstathiadis, Pradeep Haldar "Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling," Journal of Electronic Packaging, 2006, vol.128, p.267
-
(2006)
Journal of Electronic Packaging
, vol.128
, pp. 267
-
-
Ye, H.1
Efstathiadis, H.2
Haldar, P.3
-
5
-
-
84983273084
-
Evaluation of Temperature Distribution of a Power Semiconductor Chip Using Electrothermal Simulation
-
Osamu Usui, Hirotaka Muto, Toshiyuki Kikunaga, "Evaluation of Temperature Distribution of a Power Semiconductor Chip Using Electrothermal Simulation," IEEJ Trans. IA, vol.124, no.1, 2004, pp.108-115
-
(2004)
IEEJ Trans. IA
, vol.124
, Issue.1
, pp. 108-115
-
-
Usui, O.1
Muto, H.2
Kikunaga, T.3
-
6
-
-
50049089668
-
Study on Thermal Performance of Lead Frame Interconnection to Power Devices
-
Yoshinari Ikeda, Kasuhiko Yoshihara, Yuji Iizuka, Mitsuo Yamashita "Study on Thermal Performance of Lead Frame Interconnection to Power Devices," JSME annual meeting 2004(6), pp.67-68
-
(2004)
JSME annual meeting
, vol.6
, pp. 67-68
-
-
Ikeda, Y.1
Yoshihara, K.2
Iizuka, Y.3
Yamashita, M.4
-
7
-
-
50049130373
-
Thermal Problem of Next Generation Semiconductor Power Devices
-
Hideki Iwasaki, Katsumi Hisano, Tomonao Takamatsu "Thermal Problem of Next Generation Semiconductor Power Devices," JSME annual meeting 2003(6), pp.251-252
-
(2003)
JSME annual meeting
, vol.6
, pp. 251-252
-
-
Iwasaki, H.1
Hisano, K.2
Takamatsu, T.3
-
8
-
-
85009545192
-
-
Japan Institute Electronics Packaging
-
Yoshiyuki Nagatomo, Toshiyuki Nagase, Shoichi Shimamura "FEM Analysis of Thermal Cycle Properties of the Substrates for Power Modules," Japan Institute Electronics Packaging, 2000, vol.3, No.4, pp.330-334
-
(2000)
FEM Analysis of Thermal Cycle Properties of the Substrates for Power Modules
, vol.3
, Issue.4
, pp. 330-334
-
-
Nagatomo, Y.1
Nagase, T.2
Shimamura, S.3
-
9
-
-
50049093410
-
Assembly Technology Using Lead-free Solder
-
Tadanobu Matsumura, Tsuyoshi Yamamoto "Assembly Technology Using Lead-free Solder," FUJITSU, vol.56, no.6, 2005, pp.545-551
-
(2005)
FUJITSU
, vol.56
, Issue.6
, pp. 545-551
-
-
Matsumura, T.1
Yamamoto, T.2
-
10
-
-
0003820947
-
-
National Astronomical Observatory of Japan, Maruzen, Japan
-
National Astronomical Observatory of Japan, "Chronological Scientific Tables," Maruzen, Japan, 2006
-
(2006)
Chronological Scientific Tables
-
-
-
11
-
-
40449116580
-
Low-cycle fatigue reliability evaluation for lead free solders in vehicle electronics devices
-
Qiang Yu, Tadahiro Shibutani, Akifumi Tanaka, Takahiro Koyama, Masaki Shiratori "Low-cycle fatigue reliability evaluation for lead free solders in vehicle electronics devices," Proceedings of Inter PACK'07, IPACK2007-33250
-
Proceedings of Inter PACK'07, IPACK2007-33250
-
-
Yu, Q.1
Shibutani, T.2
Tanaka, A.3
Koyama, T.4
Shiratori, M.5
|