Low-cycle fatigue reliability evaluation for lead-free solders in vehicle electronics devices

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 1, Issue , 2007, Pages 531-537

  Yu, Qiang ^a   Shibutani, Tadahiro ^a   Tanaka, Akifumi ^a   Koyama, Takahiro ^a   Shiratori, Masaki ^a  

^a YOKOHAMA NATIONAL UNIVERSITY   (Japan)

Author keywords

BGA solder joints; Chip component; Inelastic strain range; Lead free solder; Low cycle fatigue; Reliability

Indexed keywords

BGA SOLDER JOINTS; CHIP COMPONENTS; INELASTIC STRAIN RANGE; LEAD-FREE SOLDERS; LOW CYCLE FATIGUE;

AUTOMOBILE ELECTRONIC EQUIPMENT; FATIGUE CRACK PROPAGATION; FINITE ELEMENT METHOD; ISOTHERMS; RELIABILITY THEORY;

SOLDERED JOINTS;

EID: 40449116580     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33250     Document Type: Conference Paper

References (8)