Robust thermal design for power device package using response surface methodand Monte Carlo simulation

2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007

Volumn 2, Issue , 2007, Pages 727-732

  Yokono, Yasuyuki ^a   Hisano, Katsumi ^a   Hirohata, Kenji ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

POWER DEVICE PACKAGE; THERMAL CONDUCTION; THERMAL DESIGN;

COMPUTER SIMULATION; HEAT CONDUCTION; HEAT RESISTANCE; MONTE CARLO METHODS; PARAMETER ESTIMATION; PARETO PRINCIPLE;

ELECTRONICS PACKAGING;

EID: 43449094997     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/HT2007-32168     Document Type: Conference Paper

References (8)