Integration of low resistive CVD-W interconnects for sub-50nm FEOL application

2008 IEEE International Interconnect Technology Conference, IITC

Volumn , Issue , 2008, Pages 147-149

  Kim, Choon Hwan ^c   Rho, Il Cheol ^c   Rouh, Kyoung Bong ^c   Lim, Kwan Yong ^c   Kim, Yong Soo ^c   Ku, Ja Chun ^c   Sohn, Yong Sun ^c   Kang, Hyo Sang ^a   Kim, Hyeong Joon ^b  

^a Hynix Semiconductor Inc   (South Korea)

^b Seoul National University   (South Korea)

^c NONE

Author keywords

[No Author keywords available]

Indexed keywords

INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE; SUB-50 NM;

CHEMICAL VAPOR DEPOSITION;

EID: 50949125934     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2008.4546951     Document Type: Conference Paper

References (3)

1. A. Buerke and S. Shmidauer, Conference Proceedings., AMC XXI, p. 239 Materials Research Society (2006).
2. S. Smith, K. Aouadi, J Collins, E. Van der Vegt, Marie-The'rese Basso, M. Juhel, and S. Pokrant, Microelectronic Engineering 82, 261 (2005).
3. S. H. Kim, E. S. Hwang et al., J. Electrochem. Soc. 152, C408-417 (2005).